Outsourced Semiconductor Assembly and Test Services (OSAT) Market Overview
The outsourced semiconductor assembly and test services (OSAT) market was valued at USD 37.95 billion in 2021, and it is projected to be worth USD 60.19 billion by 2027, registering a CAGR of 7.47% during the period, 2022-2027. According to the Semiconductor Industry Association (SIA), global semiconductor industry sales were USD 43.6 billion in May 2021, an increase of 26.2% over May 2020, a total of USD 4.6 billion, and 4.1% more than the April 2021 total of USD 41.9 billion. Further, the sales of semiconductors in April 2021 witnessed an increase of 1.9% from March 2021 at USD 41.0 billion and an increase of 21.7% compared to April 2020 at USD 34.4 billion.
The rising commercialization of applications like AI and 5G is also fueling advancements in packaging platforms, like Fan-Out Packaging and the 3D Flip Chip technology, to address the high-power consumption need and provide benefits such as greater chip connectivity. This forces many companies to collaborate with OSAT vendors; hence, many OSATs such as ASE/SPIL, Amkor, and JCET invest in various advanced SiPs and fan-out technology to gauge their competition. OSAT providers are third-party service providers of semiconductor assembly, packaging, and testing of semiconductor ICs. OSAT has been playing a crucial role in the semiconductor industry by bridging the gap between the design and availability of ICs.
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Mordor Intelligence has segmented the OSAT Market based on service type, type of packaging, application, and geography:
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