Advanced Packaging Market Overview
The advanced packaging market is expected to reach a value of USD 38.16 billion by 2026, registering a CAGR of 7.84% over the forecast period. Advanced packaging technology has evolved to minimize the cost involved and enhance the overall throughput and performance of ICs. Further, With the augmented adoption of semiconductor ICs in automobiles, the demand for advanced packaging has increased considerably in recent years. The innovation in the packaging technology is also related to an increase in the functional density of large system-on-chip solutions. As a result, the focus on heterogeneous integrations and wafer-level packages have prompted the chip industry to develop a new set of solutions, collectively known as advanced packaging. Another significant trend affecting the advanced packaging market is the increase in the size of silicon from 100 mm to 300 mm. The shift to longer diameter wafers has reduced the cost of manufacturing by 20-25%, which is expected to drive this capital into advanced packaging solutions.
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Advanced Packaging Market – Geographical Overview
The Asia Pacific region is accounted for the largest advanced packaging market share of 64.01% in 2020
The Asia Pacific holds a prominent share of the market due to a significant number of semiconductor manufacturing operations happening in the region. The pure-play manufacturers operating in the region are increasing their production capacity to cater to the growing demand from fabless vendors. China is also trying to consolidate its substrate manufacturing market. Manufacturers in the Asia-Pacific region focus on increasing their customer base in North America due to increasing demand from data centers and AI. Japan holds a significant position in the semiconductor industry as it is home to some of the major IC chipset manufacturers and electronics industry.
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Mordor Intelligence has segmented the global advanced packaging market on the basis of packaging platform and geography:
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